Instrument: |
Flip-chip bonder FinePlacer Pico (Automatic Force 2-700 N) |
Contact: |
Hoang-Vu Nguyen |
Technology Description: |
The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding. Designed for prototyping or low-volume production, R&D and universities.
Highlights
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Technical Information: |
Category: Bonding and packaging Area name: G2-33 Cleanroom Room area: 500 Model: FinePlacer Pico Manufacturer: FineTech GmbH (Germany) |
