Wire Bonder

Instrument:

Kulicke & Soffa 4522

Contact:

Sigurd.Moe@sintef.no
Lars.G.W.Tvedt@sintef.no

Booking:

MiNaLab@sintef.no

Sample Specifications:

No special restrictions

Technology Description:

Semi-automatic Au ball wire bonder with 30 µm wire. Both ball bonding and ball bumping capabilities.

Technical Information:

Multi-process ball bonder for gold wires

  • Independent Manual Z axis control, separate from X and Y axis control
  • Digitally controlled bond force
  • Deep access bonding (up to 12 mm)
  • Ball bumping capability
  • High-end digital electronic flame off
  • Bonding temperatures up to 250 ± 0.5°C