Wafer Dicing Saw

Instrument:

Disco DAD 321 (dicer) and Disco DSC141 (spin-rinse-dryer)

Contact:

Sigurd.Moe@sintef.no

Booking:

MiNaLab@sintef.no

Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti
  • Glass (with exceptions)
  • Polymers (with exceptions)
  • Noble metals (with exceptions)

Technology Description:

The tool is an automatic dicing saw suitable for R&D applications and small scale production. It is equipped with a CCD camera and a 5” monitor.In addition there is a wafer spin-rinse-dryer tool that makes sure that the diced components are clean and dry after the dicing. The wafer can be cut into dice of any size and angles.

Technical Information:

Max wafer size: 150 mm
Manual load dicing saw
30.000 rpm Spindle
Motorized 360° Theta