Instrument: |
Disco DAD 321 (dicer) and Disco DSC141 (spin-rinse-dryer) |
Contact: |
Sigurd.Moe@sintef.no |
Booking: |
MiNaLab@sintef.no |
Sample Specifications: |
100 mm and 150 mm Si wafers
|
Technology Description: |
The tool is an automatic dicing saw suitable for R&D applications and small scale production. It is equipped with a CCD camera and a 5” monitor.In addition there is a wafer spin-rinse-dryer tool that makes sure that the diced components are clean and dry after the dicing. The wafer can be cut into dice of any size and angles. |
Technical Information: |
Max wafer size: 150 mm |
