Bond Aligner, EVG

Instrument:

EVG620 bond aligner

Contact:

Erik.Poppe@sintef.no

Booking:

MiNaLab@sintef.no

Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti

Technology Description:

Si-Si aligning:The first wafer is loaded and a picture is taken of the alignment marks. A cross placed on the picture of the mark. The next wafer is loaded and a camera system aligns the wafer to the cross. The two wafers are clamped on a bond chuck with a spacer as separation. Hence, the alignment marks must be placed one at the inside and one at the outside of the final laminate.

Technical Information:

The window for the bond alignment camera is between 15 and 75 mm left and right from the centre, and within 12 mm from the centre line in the y-direction. The alignment marks should be placed well inside this region to allow for some uncertainty in the loading of wafers on the slide.Alignment accuracy depends on bond aligner and bonder in combination. It’s generally hard to get better than +/-10 µm at each side. Wafers without patterns can be mechanically aligned with accuracy good enough for automated handling after bonding, typically better than +/-0.5 mm.