Flip-chip bonder FinePlacer Pico (Automatic Force 2-700 N)

Instrument:

Flip-chip bonder FinePlacer Pico (Automatic Force 2-700 N)

Contact:

Hoang-Vu Nguyen

Technology Description:

 

The FINEPLACER® pico ma, a multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm.

This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bonding.

Designed for prototyping or low-volume production, R&D and universities.


 

Highlights

  • Placement accuracy 5 µm*
  • Components from 0.125 mm x 0.125 mm to 100 mm x 100 mm*
  • Working area up to 450 mm x 234 mm*
  • Supports wafer/substrate sizes* up to 8" *
  • Supports bonding forces up to 400 N*
  • Can be configured as a hot air rework system
  • Manual and semi-automatic configurations

Technical Information:

Category: Bonding and packaging Area name: Cleanroom Room area: 500 Model: FinePlacer Pico Manufacturer: FineTech GmbH (Germany)