Back-end processing including dicing, flip chip bonding and pick and place
Bonding and packaging
USN MST-Lab
- Ball bonder - TPT HB100
- Bond pull tester Micropull
- Die Attach Laurier Inc.
- Die Bonder, TPT
- Flip-chip bonder FinePlacer Pico (Automatic Force 2-700 N)
- Flip-chip bonder FinePlacer Pico (Manual Force 1-40 N)
- IR-Camera Pixelink PL-B74EF
- Optical Microscope, Zeiss V12
- Shear tester Delvotec 5600
- Ultrasonic bath FB15051
- Ultrasonic Cleaning Brandson
- Vacuum welder, Budatec
- Wafer Bonding System EVG 501
- Wire bonder (Ball)
- Wire Bonder (Ball) Delvotec 5610
- Wire bonder(wedge), TPT
- Wirebonder (Ball) manual Delvotek5410
