Resist Coater Maximus

Instrument:

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Sample Specifications:

100 mm and 150 mm Si wafers

• Si/SiO₂/Si_xN_y
• Al/W/Ti

Technology Description:

This tool is used for spin coating of a photo resist film on silicon wafers. This is the first step of a photolithography process. The thickness of the film is obtained by the result of the resist specifications (viscosity) and the chuck speed. In order to dry the resist film after spinning,  the wafers can be baked in one of the hotplates available in the tool.

Technical Information:

The Maximus 804 is a production tool with high output.

• Up to 100 wafers / hour.
• fully automated handling cassette to cassette
• 8 cassette stations
• 2 coating units
• 4 hotplates (temperature from 20 to 250°C)
• Automatic dispense (2 resist lines per coating unit)
• Possibility for manual dispense
• Chuck speed: up to 4000 rpm
• To avoid any damage to wafers under processing, the spin-coater utilizes edge handling