Resist Coater ACS200





Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti

Technology Description:

This tool is used for the spin coating a photo resist film on silicon wafers. This is the first step of a photolithography process. The thickness of the film is obtained by the result of the resist specifications (viscosity) and the chuck speed. In order to dry the resist film after spinning the wafers can be baked in one of the hotplates available in the tool.

Technical Information:

  • fully automated handling cassette to cassette
  • 1 coating unit
  • 2 hotplates (temperature from 20 to 250°C)
  • 1 priming unit (HMDS)
  • Automatic dispense (2 resist lines)
  • Possibility for manual dispense
  • Chuck speed: up to 5000 rpm
  • To avoid any damage to wafers under processing, the spin-coater utilizes edge handling