Plasma Cleaners


Plasma Cleaners


Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti
  • Glass (with exceptions)
  • Noble metals (with exceptions)

SINTEF MiNaLab has two very similar systems, one with less material restrictions than the other.

Technology Description:

A tool using microwave oxygen plasma to remove organics on the surfaces. High frequency applied in a vacuum chamber activates gas molecules and atoms. This allows organic deposits to be removed in a dry process.Typical processes:

  • Photoresist stripping, including after being exposed to high temperatures as after implantation, ion etching, sputter etching, RIE
  • Surface cleaning after storage
  • Surface cleaning as part of photolithography after wet developing prior to wet or plasma etching
  • Removal of organic passivating layers and masks
  • Removal of polyimide layers

Technical Information:

Power: 1000 W

Frequency: 2.45 GHz

Process pressure: approx. 0.2 – 2 mbar

Gas : O2