Mask Aligner MA150 KWS

Instrument:

 SUSS Microtec MA150 KWS fullfield proximity aligner

Contact:

 Hannah.Tofteberg@sintef.no
Lars.Breivik@sintef.no

Booking:

 MiNaLab@sintef.no

Sample Specifications:

100 mm and 150 mm Si wafers with primary flat

  • Si/SiO2/SixNy
  • Al/W/Ti
  • Glass (with exceptions)
  • Noble metals (with exceptions)

Technology Description:

Maskaligners are used in photolithography to transfer a pattern on a photomask to a photoresist on a wafer. This photoresist can then serve as e.g. an etch mask to transfer the pattern into the wafer. The photoresist can also be removed after metal deposition, leaving a metal pattern on the wafer (lift-off).

Technical Information:

A simpler model than MA150e, but there are less sample restictions on this aligner.

Contact Resolution: Pending on process but can be better than 1 μm

Exposure modes: Proximity, Soft/Hard Contact, Vacuum Contact (only 100 mm), Soft Vacuum.

(Soft and hard contact exposures give a resolution of 1-2 µm. Vacuum contact exposure give higher resolution (0,6 µm) but shortens the mask lifetime, whereas proximity exposures give lower resolution but less wear on the mask.)

  • Broadband photolithography
  • Top side alignment (TSA accuracy ± 1 μm)
  • Back side alignment is not available
  • Süss diffraction reducing optics implemented on both aligners
  • Large gap exposure for lithography on wafers with topography (~100 μm)
  • Double sided handling