Instrument: |
SUSS Microtec MA150 KWS fullfield proximity aligner |
Contact: |
Hannah.Tofteberg@sintef.no
Lars.Breivik@sintef.no |
Booking: |
MiNaLab@sintef.no |
Sample Specifications: |
100 mm and 150 mm Si wafers with primary flat
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Technology Description: |
Maskaligners are used in photolithography to transfer a pattern on a photomask to a photoresist on a wafer. This photoresist can then serve as e.g. an etch mask to transfer the pattern into the wafer. The photoresist can also be removed after metal deposition, leaving a metal pattern on the wafer (lift-off). |
Technical Information: |
A simpler model than MA150e, but there are less sample restictions on this aligner. Contact Resolution: Pending on process but can be better than 1 μm Exposure modes: Proximity, Soft/Hard Contact, Vacuum Contact (only 100 mm), Soft Vacuum. (Soft and hard contact exposures give a resolution of 1-2 µm. Vacuum contact exposure give higher resolution (0,6 µm) but shortens the mask lifetime, whereas proximity exposures give lower resolution but less wear on the mask.)
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