Coater, Gyrset RC8

Instrument:

 SUSS Gyrset RC8 spin coater

Contact:

 Lars.Breivik@sintef.no

Booking:

 MiNaLab@sintef.no

Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti
  • Glass (with exceptions)
  • Noble metals (with exceptions)

Technology Description:

This tool is used for spin coating of a photo resist film on silicon wafers. This is the first step of a photolithography process. The thickness of the film is obtained by the result of the resist specifications (viscosity) and the chuck speed.

Technical Information:
  • Manual wafer handling
  • Automatic dispense
  • Possibility for manual dispense
  • Chuck speed: up to 4000 rpm
  • To avoid any damage to wafers under processing, the spin-coater utilizes edge handling