Instrument: |
Annealsys AS-Master 2000 RTP |
Contact: |
Lars.Breivik@sintef.no
Mads.Blyberg@sintef.no |
Booking: |
MiNaLab@sintef.no |
Sample Specifications: |
100 mm and 150 mm Si wafers
|
Technology Description: |
Typical applications would be repair of crystal damage after implantation (while minimizing the redistribution of doping atoms) and annealing of silicon-metal systems. Cold wall chamber technology provides high process reproducibility in an ultra clean and contamination free environment. Single wafer processing and ten independent heating zones provides excellent process uniformity. |
Technical Information: |
Maximum temperature: 1250oC |
