Reactive Ion Etch

Instrument:

Reactive Ion Etch

Contact:

Halvor Dolva
Viktor Bobal

Technology Description:

Material Class:

 

Technology Description:

 

The reactive ion etch (RIE) is an isotropic and directional dry etching for SiO2, Si3N4, Si, polymers, metals (limited performance) and surface plasma treatment.

Technical Information:

Type: Advanced Vacuum Vision 320 MK IISize: Up to 12″ wafer size

 

Technical Information:

Category: Dry etching Area name: Clean Room Room area: 440 Model: Vision 320 MK II Manufacturer: Advanced Vacuum