TePla plasma asher


TePla plasma asher


Martijn de Roosz
Mark Chiappa

Technology Description:

The TePla 300 Plasma asher can be used to strip off photo resist, descum or for cleaning of a wafer surface. 

Available process gases: O2, Ar, N2

Maximum power: 1000W

Technical Information:

Category: Dry etch Area name: Chemical area Model: TePla 300 Manufacturer: PVA