Electroplating of Cu and Sn


Electroplating of Cu and Sn


Zekija Ramic

Technology Description:

Electroplating is a plating/deposition process in which metal ions in a solution are moved by an electric field to coat an electrode. The process uses electrical current toreduce cations of a desired material from a solution and coat a conductiveobject with a thin or thick layer of the material, such as a metal. Possible metals to plate are Au, Cu, Sn and Pt by either using DC, pulse (PC) or pulse reverse current (PRC). The advantages of PC and PRC compared to DC is that a more uniform film is obtained at a faster deposition rate, because the negatively charged layer around the cathode preventing the ions to reach the sample (cathode) is somewhat discharged and redistributed during pulse off time.Possible processes:


  • DC, PC and PRC Electroplating
  • Au, Cu, Sn and Pt Metals

    Technical data: Handles 100mm wafers and pieces.

Technical Information:

Category: Thin film deposition Area name: G2-33 Cleanroom Room area: 500 Model: PGG 20 Manufacturer: Heimerle + Meule