PECVD

Instrument:

 PECVD

Contact:

 Halvor Dolva
Viktor Bobal

Technology Description:

Material Class:

  

Technology Description:

 

 The PECVD system is a Plasma-enhanced chemical vapor deposition mainly for deposition of SiO2, Si3N4 and a-Si.

Technical Information:

 Type: Advanced Vacuum Vision 310 MK II

Restrictions: Polymers and organic materials are not allowed in the chamber.

 

Size: Up to12″ wafer size

 

Technical Information:

 Category: Plasma deposition Area name: Clean Room Room area: 440 Model: Vision 310 MK II Manufacturer: Advanced Vacuum