Angstrom – E-beam and thermal PVD


Angstrom - E-beam and thermal PVD


Kristin Bergum
Viktor Bobal

Technology Description:

The EvoVac chamber from Ångstrom Engineering have three independently controlled evaporation sources - two thermal and one e-beam. The system can be used to deposit metals and also metal oxides by introducing a controlled leak of O2. The substrate holder can be rotated and water cooled/heated (~500oC) during deposition. An RF source is available for plasma cleaning of the substrate.

Technical Information:

Category: Thin film deposition Area name: Clean Room Room area: 440 Model: EvoVac Manufacturer: √Öngstrom Engineering