PECVD

Instrument:

PECVD

Contact:

Halvor Dolva
Viktor Bobal

Technology Description:

Material Class:

 

Technology Description:

 

The PECVD system is a Plasma-enhanced chemical vapor deposition mainly for deposition of SiO2, Si3N4 and a-Si.

Technical Information:

Type: Advanced Vacuum Vision 310 MK II

Restrictions: Polymers and organic materials are not allowed in the chamber.

 

Size: Up to12″ wafer size

 

Technical Information:

Category: Plasma deposition Area name: Clean Room Room area: 440 Model: Vision 310 MK II Manufacturer: Advanced Vacuum