DC/RF sputter tool – NanoPVD

Instrument:

DC/RF sputter tool - NanoPVD

Contact:

Kristin Bergum
Heine Nygard Riise

Technology Description:

Material Class:

Available targets: Al, ZnO, Si, Ge, SiGe, Cu, Ag, more targets available on request.

Technology Description:

 

Magnetron sputtering is a  technique which can be used for thin film deposition with a wide range of materials – in principle any solid metal or alloy and a variety of compounds. Sputtering is the removal of atomized material from a solid due to energetic bombardment of its surface layers by ions or neutral particles. The NanoPVD offers co-deposition of two targets, and multilayer films without breaking vacuum. The NanoPVD is intended for processes which are "dirty", i.e. all processes which are not epitaxial or involve materials which are not allowed in the Semicore, old Moorfield or cluster tool.

Technical Information:

Type: Semicore TriAxis

Source: 1 DC max power 850 W and 1 RF max power 150 W. Although only two sources are available, there are three target positions. The RF source is shared between targets 2 and 3.

3 x 2” Target

4” Single wafer chamber

Technical Information:

Category: Thin film deposition Area name: Clean Room Room area: 440 Model: NanoPVD Model S10A Manufacturer: Moorfield