Automatic CSD PZT deposition

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Sample Specifications:

150 and 200 mm wafers

• Si/SiO₂/Si_xN_y
• Noble metals (with exceptions)

The samples must be able to withstand >600 °C.

Technology Description:

PZT realized through chemical solution deposition (CSD). CSD is a very versatile method as it provides excellent stoichiometry control and coverage of large surface areas. In this method a precursor solution of metal organics is deposited by spin-coating and dried/pyrolyzed. The resulting amorphous film is then crystallized after the desired thickness is reached.The application procedures used for CSD are quite similar to what is used in the semiconductor industry for application of photoresist today, which is a proven high throughput process. The difference between the two processes is the number of coatings necessary to achieve the total film thickness.

Technical Information:

Fully automated fabrication tool for piezo-ceramic films from chemical solutions. It consists of a specially adapter coater cluster, an RTP-furnace and the robotics for handling the wafers.Highlights of the automated CSD tool:

• RTP integrated into coating tool for PZT crystallisation
• Crossed lamp arrays with 18 kW each below and on top of the wafer (36 kW in total).
• Optimization of RTP heat radiation through independent control of upper lamp array
• Wafer handling at the edges only to minimize thermal non-uniformity on coated PZT layers
• Hermetically closed cabin permits operation under laminar flow conditions and prevents operators from coming into contact with toxic gases
• High temperature hotplates (max. 450°C) for pyrolysis
• Electrically controlled lifting pins in the hotplates permit arbitrary temperature profiles
• Three precision media pumps for coating solutions.
• Solvent saturated atmosphere in parking position prevents dispensing nozzles from drying and keeps PZT destroying vapour away from the PZT.