Instrument: |
Zygo NewView 6300 |
Contact: |
Lars.G.W.Tvedt@sintef.no |
Booking: |
MiNaLab@sintef.no |
Sample Specifications: |
All shapes from small wafer pieces and devices up to 150 mm Si wafers
|
Technology Description: |
White light interferometry, also known as coherence scanning interferometry or vertical scanning interferometry (VSI), is used to produce high quality three-dimensional surface maps. For characterizing and quantifying surface roughness, step heights, critical dimensions, and other topographical features with excellent precision and accuracy. All measurements are nondestructive, fast, and require no sample preparation. Dynamical characterization of MEMS is also available. |
Technical Information: |
Vertical resolution: 0.1 nm, independent of surface texture, magnification or feature height Vertical measurement range: 0.1nm to 15mm Objectives: 1x, 5x, 5x GC (Glass Compensated), 20x, 50x and 100x Field-of-View: Selectable from 0.04 to 14 millimeters; larger area imaged with field stitching High speed camera resolution: 640 x 480 pixel Stage travel: 150 mm Transparent films: 1-50 µm DMEMS: Dynamical measurements, 10MHz, 200V amp |
