Automatic Inspection

Instrument:

 August Technology NSX95

Contact:

 Niaz.Ahmed@sintef.no

Booking:

 MiNaLab@sintef.no

Sample Specifications:

100 mm and 150 mm Si wafers

  • Si/SiO2/SixNy
  • Al/W/Ti

Technology Description:

Automatic wafer inspection to detect micro defects (typically 0.5 µm and larger).

Technical Information:
  • Single and double sided wafers
  • Robot for cassette-to-cassette handling of 4 inch and 6 inch wafers (with edge-handling)
  • Wafer thickness range 135 – 2000 µm